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标题: A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test
作者: Zhou, Ping; Shi, Haosong; Wang, Lin; Hou, Changyu; Meng, Lei; Di, Hongyu; Guo, Dongming
论文类型: 期刊论文
期刊/会议名称: INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
年: 2023
卷: 239
期: